1 - 10 of 133
bt sip package substrate
Selling leads
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ...
2024-12-09 20:55:08
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Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0...
2024-12-09 19:57:48
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...:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 19:38:04
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... electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material ...
2024-12-09 19:38:04
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...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable ...
2024-12-09 20:55:08
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ...
2024-12-09 19:45:11
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ...
2024-12-09 20:39:36
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...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ...
2024-12-09 21:20:17
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 22:05:34
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