China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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bt sip package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
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bt sip package substrate

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ENEPIG plating ic package substrate manufacture

ENEPIG plating ic package substrate manufacture for sale
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing for sale
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF ... 2024-12-09 21:20:17

FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:44:49

semiconductor FCCSP package substrate manufacture in HOREXS

semiconductor FCCSP package substrate manufacture in HOREXS for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:46:53

FCBGA/BGA package substrate manufacture

FCBGA/BGA package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

MEMS package substrate manufacture

MEMS package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCCSP Flipchip package substrate manufacture

FCCSP Flipchip package substrate manufacture for sale
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

NAND/FLASH Memory Ic packaging Substrate

NAND/FLASH Memory Ic packaging Substrate for sale
...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

line/space 25um FBGA Package Substrate For Memory ic packaging

line/space 25um FBGA Package Substrate For Memory ic packaging for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

finleLine Space IC Package Substrate for Wearable and Automotive Electronics for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11
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