21 - 30 of 133
bt sip package substrate
Selling leads
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ...
2024-12-09 21:20:17
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... ; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...
2024-12-09 19:38:04
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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...:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 21:20:17
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...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor ...
2024-12-09 19:55:37
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...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ...
2024-12-09 20:39:36
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