China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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bt fr4 package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details
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bt fr4 package substrate

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...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ... 2024-12-09 19:38:04
...BT IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card... 2024-12-09 21:05:17
... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04
... thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04
... industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; ... 2024-12-09 19:38:04
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0... 2024-12-09 19:57:48
... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ... 2024-12-09 20:55:08
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ... 2024-12-09 20:55:08
...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ... 2024-12-09 20:39:36
...Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic ... 2024-12-09 19:38:04
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