31 - 40 of 138
bt fr4 package substrate
Selling leads
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...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand...
2024-12-09 19:38:04
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...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand...
2024-12-09 19:38:04
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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...3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished...
2024-12-09 21:44:49
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...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor ...
2024-12-09 19:55:37
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...package,MEMS,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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... MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
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... space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4)...
2024-12-09 19:38:04
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of ...
2024-12-09 19:55:37
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