China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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boc pacakge fr4 substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
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boc pacakge fr4 substrate

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UDP/USB memory substrate manufacture supporting

UDP/USB memory substrate manufacture supporting for sale
... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ... 2024-12-09 19:38:04

wire bonding memory substrate with gold plating manufacture

wire bonding memory substrate with gold plating manufacture for sale
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

13 years experience of Nand/Flash memory substrate manufacture

13 years experience of Nand/Flash memory substrate manufacture for sale
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

MGC BT Memory substrate 4L with ENEPIG plating

MGC BT Memory substrate 4L with ENEPIG plating for sale
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

0.2mm 4L BT memory substrate manufacture JEDEC standard

0.2mm 4L BT memory substrate manufacture JEDEC standard for sale
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

RF Module substrate impedance control 4L BT material soft gold

RF Module substrate impedance control 4L BT material soft gold for sale
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

Fingerprint sensors packaging substrate manufacture supporting

Fingerprint sensors packaging substrate manufacture supporting for sale
...4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic... 2024-12-09 19:38:04

Semiconductor sensors substrate manufacture

Semiconductor sensors substrate manufacture for sale
...,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; ... 2024-12-09 19:38:04

0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics

0.2mm Ultrathin MEMS packaging substrate fabrication for microphone&microelectronics for sale
... pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness... 2024-12-09 19:38:04

FCCSP package substrate 4L Buildup types ENEPIG

FCCSP package substrate 4L Buildup types ENEPIG for sale
...package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; ... 2024-12-09 19:38:04
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