boc pacakge fr4 substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

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boc pacakge fr4 substrate

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MiniLED substrate manufacture supporting

...substrate for Mini LED/Micro LED Application:MiniLED/Mirco LED Line space/width:1mil (25um) Spec.of pcb production: FR4/BT (0.1-1.0mm) finished ... 2024-12-09 19:38:04

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

HOREXS semiconductor ic package substrate With Chip Wire Bonding

...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand... 2024-12-09 19:38:04

4L build up types 0.8mm Gold Surface IC Package Substrate

...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand... 2024-12-09 19:38:04

Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

Horexs Ultra thin MEMS package substrate manufacture supporting

...,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ... 2024-12-09 19:38:04

Sip package substrate BT material 4 layer ENEPIG

...,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

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