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bga ic package substrate
Selling leads
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FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
2024-12-09 20:55:08
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
2024-12-09 20:55:08
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...package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controller...
2024-12-09 20:55:08
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Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 19:38:04
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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
2024-12-09 21:20:17
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... memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package...
2024-12-09 19:38:04
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...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ...
2024-12-09 19:38:04
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Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: ...
2024-12-09 19:38:04
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage...
2024-12-09 19:38:04
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