51 - 60 of 137
bga ic package substrate
Selling leads
|
...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ...
2024-12-09 21:20:17
|
|
POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate...
2024-12-09 20:39:36
|
|
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 20:55:08
|
|
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ...
2024-12-09 21:20:17
|
|
COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
2024-12-09 20:39:36
|
|
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
|
|
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
|
|
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 20:39:36
|
|
Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space...
2024-12-09 19:38:04
|
|
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0...
2024-12-09 19:57:48
|