51 - 60 of 117
2 layers ic package substrate
Selling leads
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...,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1...
2024-12-09 19:38:04
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...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,...
2024-12-09 19:57:48
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FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
2024-12-09 20:55:08
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
2024-12-09 20:55:08
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...package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controller...
2024-12-09 20:55:08
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Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
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... memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package...
2024-12-09 19:38:04
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...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ...
2024-12-09 19:38:04
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...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ...
2024-12-09 20:39:36
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POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate...
2024-12-09 20:39:36
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