China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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2 layers ic package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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2 layers ic package substrate

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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11
...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top ... 2024-12-09 19:45:11
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11
...,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is ... 2024-12-09 19:38:04
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package... 2024-12-09 19:55:37
...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ... 2024-12-09 21:20:17
BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ... 2024-12-09 20:55:08
BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ... 2024-12-09 21:20:17
Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc... 2024-12-09 20:55:08
Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc... 2024-12-09 21:20:17
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