25um fcbga package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

31 - 40 of 133

25um fcbga package substrate

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Tenting process 25um DRAM IC package Substrate BT material 4 Layer

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

semiconductor FCCSP Package Substrate manufacture

Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ... 2024-12-09 21:44:49

FCCSP package substrate 4L Buildup types ENEPIG

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 19:38:04

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 21:20:17

MicroLED/MniLED package substrate manufacture

... ; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly ... 2024-12-09 19:38:04

Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness... 2024-12-09 19:38:04

BT semiconductor IC packaging substrate manufacture

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

Flash/NAND memory package substrate production

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

Multilayer BT materials semiconductor package substrate manufacture

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

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