25um fcbga package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

11 - 20 of 133

25um fcbga package substrate

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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

...IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor ... 2024-12-09 19:55:37

semiconductor FCCSP package substrate manufacture in HOREXS

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 21:46:53

MEMS package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

High-Performance SiP Package Substrate for IoT Electronics

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

FCCSP Flipchip package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34

ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct... 2024-12-09 20:39:36

0.15mm Thickness 2 Layers IC Package Substrate For memory package

...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; ... 2024-12-09 19:47:52

JEDEC Standard eMCP IC Package Substrate Fabrication

...,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space... 2024-12-09 19:38:04

semiconductor packaging Substrate of DRAM Memory manufacture

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:55:37

MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 20:39:36

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