11 - 20 of 30
0 5oz copper ic package substrate
Selling leads
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...package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished ...
2024-12-09 19:57:48
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Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:10-15um or ...
2024-12-09 21:44:49
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ...
2024-12-09 19:38:04
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Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: ...
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0
2024-12-09 19:45:11
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ...
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ...
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ...
2024-12-09 19:38:04
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