1 - 10 of 30
0 5oz copper ic package substrate
Selling leads
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Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, ...
2024-12-09 21:20:17
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0
2024-12-09 19:45:11
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...IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
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...IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 21:20:17
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MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei ...
2024-12-09 20:39:36
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0
2024-12-09 19:45:11
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ...
2024-12-09 19:38:04
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0
2024-12-09 19:45:11
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...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0
2024-12-09 19:45:11
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