1 - 10 of 52
kovar to transistor packages
Selling leads
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... resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have different ...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...
2025-05-13 09:46:55
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...Package,pin,lid are plated Ni:1.3~11.43um;Package and pins are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42(42alloy) 1 ...
2025-05-13 09:46:55
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Product Name Robust Transistor Outline Header with Cap Product Model JOPTEC Plating Coating Fully plating Au or selective plating Robust Transistor ...
2025-05-13 09:46:55
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...Ω Hermeticity:Leak rate≤1*10-3Pa.cm3/s 1. Eyelet Kovar Kovar 2. Pin1 Kovar Kovar 3. Pin2 Kovar Kovar 4. Glass insulators BH-A/K BH-A/K 5. Pin3 ...
2025-05-13 09:46:55
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... resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have different ...
2025-05-13 09:46:55
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...package Product Model JT-TO Product Formation Material Quantity 1. Base Kovar 1 2. Pin Kovar 4 3. Glass insulator BH-A/K 4 4. Brazing ring HlAgCu28 ...
2025-05-13 09:46:55
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... Ni:4-11.43um. Product formation: Material Quantity 1. Cap 10#Steel 1 2. Welding ring HLAgCu28 1 3. Lead 1 4J29(Kovar) 1 4. Glass insulator BH-G/K ...
2025-05-13 09:46:55
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Product name: High Volume TO Header TO-39 Header Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0...
2025-05-13 09:46:55
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