China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
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kovar to transistor packages

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kovar to transistor packages

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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ... 2025-05-13 09:46:55
...Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the lead ... 2025-05-13 09:46:55
...Pin2 Kovar 1 Insulation Resistance 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features ... 2025-05-13 09:46:55
Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: ... 2025-05-13 09:46:55
...Package Finish: Fully plating Au(or choose selective plating). Plating coating: The package, lead and cover are plated Ni: 1.3-11.43um, 1,and the ... 2025-05-13 09:46:55
Product name Well Suited Kovar Alloy Package Gold Plating Butterfly Package Finish Fully plating Au or selective plating Au Plating coating Shell and ... 2025-05-13 09:46:55
... formation: Material Quantity 1. Cover plate 4J42(42alloy) 1 2. Welding ring HLAgCu28 3 3. Glass insulator BH-C/K 5 4. Lead 4J29(Kovar) 2 5. Cavity ... 2025-05-13 09:46:55
... Au ≥0.8um Product information: Material Quantity 1. cover plate 4J42(42alloy) 1 2. insulators BH-G/K 24 3. lead 4J29(Kovar) 24 4. cavity 4J29... 2025-05-13 09:46:55
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