China Hermetically Sealed Electronic Packages manufacturer
JOPTEC LASER CO., LTD
Laser Components and Beyond
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kovar to transistor packages

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kovar to transistor packages

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...Package Flat Bottom Package With 1.5mm Depth In Top Seal Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated ... 2025-05-13 09:46:55
... resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have different ... 2025-05-13 09:46:55
...Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the lead ... 2025-05-13 09:46:55
... Au≥1.3um Product Information Material Quantity 1. Base Kovar 1 2. Brazing ring HlAgCu28 1 3. Glass insulator DM-305 15 4. Pin 1 Kovar 12 5. Pin 2 ... 2025-05-13 09:46:55
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer ... 2025-05-13 09:46:55
...package for HIC custom hermetic package Product Model JOPTEC Finish: Shell and pins are plated Ni 1-11.43um and plated Au≥1.0um Insulation ... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤1x10... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤... 2025-05-13 09:46:55
...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤... 2025-05-13 09:46:55
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