China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
111 - 120 of 124

substrate pcb electronic board

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0.26mm memory substrate fabrication with soft gold plating

0.26mm memory substrate fabrication with soft gold plating for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

UDP/USB memory substrate manufacture supporting

UDP/USB memory substrate manufacture supporting for sale
Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space... 2024-12-09 19:38:04

wire bonding memory substrate with gold plating manufacture

wire bonding memory substrate with gold plating manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

13 years experience of Nand/Flash memory substrate manufacture

13 years experience of Nand/Flash memory substrate manufacture for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

MGC BT Memory substrate 4L with ENEPIG plating

MGC BT Memory substrate 4L with ENEPIG plating for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

0.2mm 4L BT memory substrate manufacture JEDEC standard

0.2mm 4L BT memory substrate manufacture JEDEC standard for sale
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

FCCSP package substrate 4L Buildup types ENEPIG

FCCSP package substrate 4L Buildup types ENEPIG for sale
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 19:38:04

Anylayer/Buildup types Sip packaging Substrate manufacture

Anylayer/Buildup types Sip packaging Substrate manufacture for sale
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness... 2024-12-09 19:38:04

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Tenting process 25um DRAM IC package Substrate BT material 4 Layer for sale
...,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ... 2024-12-09 19:45:11

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material for sale
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width... 2024-12-09 21:20:17
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