China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
Home > Products >

stack via sip package substrate

Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details
11 - 12 of 12

stack via sip package substrate

Selling leads
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 20:55:08
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 21:20:17
Page 2 of 2 :   |< << 1 2 >> >|