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soft gold csp package substrate
Selling leads
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...package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished ...
2024-12-09 19:57:48
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 21:44:49
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...package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; ...
2024-12-09 19:38:04
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...package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; ...
2024-12-09 21:20:17
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Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
2024-12-09 19:38:04
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such
2024-12-09 19:38:04
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
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...package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
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...(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as ...
2024-12-09 19:38:04
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