China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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flip chip fccsp package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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flip chip fccsp package substrate

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...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold ... 2024-12-09 19:38:04
...,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is ... 2024-12-09 19:38:04
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
...Substrate pcb Microelectronics electronics IC substrate is a type of carry material for integrated circuit with internal circuit to connect the ... 2024-12-09 19:38:04
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
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