China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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flip chip fccsp package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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flip chip fccsp package substrate

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Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly... 2024-12-09 19:38:04
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil ... 2024-12-09 19:38:04
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS... 2024-12-09 22:05:34
...Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic ... 2024-12-09 19:38:04
...Substrate pcb IC substrate, also known as packaging substrate, is an important raw material for integrated circuit packaging, to provide electrical ... 2024-12-09 19:38:04
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ... 2024-12-09 19:57:48
...Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality ... 2024-12-09 19:38:04
...,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi ... 2024-12-09 19:38:04
...,the semiconductor packaging substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of ... 2024-12-09 19:38:04
... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is ... 2024-12-09 19:38:04
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