21 - 30 of 137
csp ic packaging substrate
Selling leads
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.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top ...
2024-12-09 19:45:11
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package...
2024-12-09 19:55:37
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...,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor ...
2024-12-09 19:38:04
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Application:Semi Package,LED chip package,Semiconductors ,Semiconductor,IC package,miniLED,MicroLED,MEMS,IC assembly,Storage IC substrage; Spec.of ...
2024-12-09 19:38:04
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
2024-12-09 20:55:08
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