China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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csp ic packaging substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
View Contact Details
91 - 100 of 134

csp ic packaging substrate

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...IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic ... 2024-12-09 19:38:04
Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04
...IC Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high ... 2024-12-09 19:38:04
... OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC ... 2024-12-09 19:38:04
...IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ... 2024-12-09 19:57:48
... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is ... 2024-12-09 19:38:04
Camera/Bluetooth/Wireless Module substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera ... 2024-12-09 20:55:08
FMC NAND/Flash memory substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash ... 2024-12-09 20:55:08
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04
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