51 - 60 of 130
bt mcp package substrate
Selling leads
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...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; ...
2024-12-09 19:47:52
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... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of ...
2024-12-09 19:55:37
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...substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package...
2024-12-09 19:38:04
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...substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of ...
2024-12-09 19:38:04
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...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
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...; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished...
2024-12-09 21:44:49
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