bt fr4 csp substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

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bt fr4 csp substrate

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Flash/NAND memory package substrate production

...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of ... 2024-12-09 19:38:04

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

HOREXS semiconductor ic package substrate With Chip Wire Bonding

...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand... 2024-12-09 19:38:04

4L build up types 0.8mm Gold Surface IC Package Substrate

...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand... 2024-12-09 19:38:04

Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

0.28mm Finished Lead Free memory chip substrate manufacture

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold... 2024-12-09 19:38:04

OEM ODM semiconductor packaging substrate China mainland

... package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material ... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

... package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material ... 2024-12-09 19:38:04

microelectronics package substrate manufacture

... (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers... 2024-12-09 19:38:04

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