21 - 30 of 108
bt fr4 csp substrate
Selling leads
|
... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
|
|
...substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor ...
2024-12-09 20:39:36
|
|
...substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory ...
2024-12-09 19:55:37
|
|
...Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor ...
2024-12-09 20:39:36
|
|
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package...
2024-12-09 19:55:37
|
|
...,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand...
2024-12-09 19:57:48
|
|
... space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4)...
2024-12-09 19:38:04
|
|
...substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...
2024-12-09 19:38:04
|
|
...,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
|
|
...,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
2024-12-09 19:38:04
|