81 - 90 of 96
bt fccsp substrate
Selling leads
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... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,...
2024-12-09 19:38:04
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... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ...
2024-12-09 19:38:04
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... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,...
2024-12-09 19:38:04
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... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ...
2024-12-09 19:38:04
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...Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
2024-12-09 19:38:04
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... electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material ...
2024-12-09 19:38:04
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... package,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
2024-12-09 19:38:04
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...,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
2024-12-09 19:38:04
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
2024-12-09 19:45:11
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
2024-12-09 19:45:11
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