4layer csp semiconductor substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

81 - 90 of 108

4layer csp semiconductor substrate

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FMC NAND / Flash Memory Substrate BT / FR4 Material 70um For Memory Cards

FMC NAND/Flash memory substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash ... 2024-12-09 20:55:08

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ... 2024-12-09 19:38:04

wirebonding packaging memory substrate with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini... 2024-12-09 19:38:04

4L SD card memory substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

0.26mm memory substrate fabrication with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

UDP/USB memory substrate manufacture supporting

Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space... 2024-12-09 19:38:04

wire bonding memory substrate with gold plating manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

13 years experience of Nand/Flash memory substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

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