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25um ic substrate packaging board
Selling leads
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
2024-12-09 19:45:11
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...Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage;IC package...
2024-12-09 19:38:04
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...Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage...
2024-12-09 19:38:04
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Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space...
2024-12-09 19:38:04
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package...
2024-12-09 19:55:37
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... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is ...
2024-12-09 19:38:04
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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),...
2024-12-09 19:38:04
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...Capacitor and Resistor in it Application:MEMS semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; ...
2024-12-09 19:38:04
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ...
2024-12-09 19:55:37
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