25um ic substrate packaging board

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

21 - 30 of 133

25um ic substrate packaging board

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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor ... 2024-12-09 19:55:37

BGA IC Package Substrate With Cap Plated MGC BT material

Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable ... 2024-12-09 19:38:04

0.2mm 2 layer Memory Card substrate Fabrication For Capsulation

...substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate... 2024-12-09 19:38:04

BT semiconductor IC packaging substrate manufacture

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

4L build up types 0.8mm Gold Surface IC Package Substrate

...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand... 2024-12-09 19:38:04

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra ... 2024-12-09 19:45:11

Flash/NAND memory package substrate production

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

Multilayer BT materials semiconductor package substrate manufacture

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package... 2024-12-09 19:38:04

line/space 25um FBGA Package Substrate For Memory ic packaging

...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top ... 2024-12-09 19:45:11

Semiconductor Package Substrate 12um copper buildup types

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

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