91 - 100 of 116
1mil flash memory ic substrate
Selling leads
|
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ...
2024-12-09 21:44:49
|
|
Description Of IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of ...
2024-12-09 19:38:04
|
|
...Wireless Module substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package...
2024-12-09 20:55:08
|
|
...IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ...
2024-12-09 19:38:04
|
|
... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
|
|
Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) ...
2024-12-09 19:38:04
|
|
Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of ...
2024-12-09 19:38:04
|
|
...IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|
|
...IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|
|
...,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|