1mil flash memory ic substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

41 - 50 of 116

1mil flash memory ic substrate

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MGC BT Memory substrate 4L with ENEPIG plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

0.2mm 4L BT memory substrate manufacture JEDEC standard

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

OEM ODM semiconductor packaging substrate China mainland

...:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of ... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:38:04

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ... 2024-12-09 19:38:04

Precision 0.15mm IC Packaging Substrate fabrication

...IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package... 2024-12-09 19:38:04

0.15mm IC assembly package substrate For semiconductor package

...IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi ... 2024-12-09 19:38:04

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