China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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0 5oz copper mcp substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
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0 5oz copper mcp substrate

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UDP/USB memory substrate manufacture supporting

UDP/USB memory substrate manufacture supporting for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

wire bonding memory substrate with gold plating manufacture

wire bonding memory substrate with gold plating manufacture for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

13 years experience of Nand/Flash memory substrate manufacture

13 years experience of Nand/Flash memory substrate manufacture for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

MGC BT Memory substrate 4L with ENEPIG plating

MGC BT Memory substrate 4L with ENEPIG plating for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

0.2mm 4L BT memory substrate manufacture JEDEC standard

0.2mm 4L BT memory substrate manufacture JEDEC standard for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

big capacity of memory packaging substrate manufacture

big capacity of memory packaging substrate manufacture for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

RF Module substrate impedance control 4L BT material soft gold

RF Module substrate impedance control 4L BT material soft gold for sale
...,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or ... 2024-12-09 19:38:04

FCCSP package substrate 4L Buildup types ENEPIG

FCCSP package substrate 4L Buildup types ENEPIG for sale
...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

FCCSP substrate manufacture supporting China

FCCSP substrate manufacture supporting China for sale
...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... 2024-12-09 19:38:04

Anylayer/Buildup types Sip packaging Substrate manufacture

Anylayer/Buildup types Sip packaging Substrate manufacture for sale
...Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki... 2024-12-09 19:38:04
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