China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with ...
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Product Tags: Stack Via Sip Package Substrate   Via Filling Sip Package Substrate   BT Sip Package Substrate  
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