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cpu sponge foam material
Selling leads
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... Pad For Battery CPU The TIF100-40-10S is an extremely soft gap filling material rated at a thermal conductivity of 4.0W/m-K. It is specially ...
2026-07-08 00:23:30
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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
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... Pad For Laptop Graphics Card CPU GPU Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines ...
2026-07-08 00:23:30
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...CPU,4.5mmT,2.0 g/cc The TIF1180-12-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ...
2026-07-08 00:23:30
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... thermal performance for CPU The TIF1140-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2026-07-08 00:23:30
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...flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the ...
2026-07-08 00:23:30
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... for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the ...
2026-07-08 00:23:30
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... retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat ...
2026-07-08 00:23:30
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... for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the ...
2026-07-08 00:23:30
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...CPU Cooling Pad With Thickness 0.5-5.0mm Low Thermal Resistance The TIF760HZ use a special process, with silicone as the base material, adding ...
2026-07-08 00:23:30
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... nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.TIF7120HZ is an electrically ...
2026-07-08 00:23:30
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