Factory Supply Variety Of Thicknesses Thermal Conductive Pad For CPU
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Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU
The TIF7180Z is an extremely soft gap filling material rated at a thermal conductivity of 7.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF7180Z is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Features
> Good thermal conductive: 7.0 W/mK > Thickness: 4.5mmT > hardness:55 shore 00 > Colour: Grey > Easy release construction
Applications
> Automotive electronics
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ? A: We are manufacturer in China Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. |
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| Product Tags: Variety Thicknesses Thermal Conductive Pad CPU Conductive Pad CPU Thermal Conductive Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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