Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance
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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance
The TIF7140Z use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Features
> Good thermal conductive: 7.0 W/mK > Thickness: 3.5mmT > hardness:55 shore 00 > Colour: Grey > Moldability for complex parts
Applications
> Automotive engine control units
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ? A: We are manufacturer in China Q: Do you offer free samples ? A: Yes, we are willing to offer free sample. Q: What is your terms of payment ? A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
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| Product Tags: Low Thermal Resistance Insulation Pad GPU CPU Cooling Insulation Pad CPU Cooling Thermal Silicone Insulation Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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