Specific Gravity 2.7g/Cc CPU Thermal Gap Pad 1.5mm
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Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU
The TIF160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-20-10UF-Datasheet-REV02.pdf
Features > Good thermal conductive: 2.0 W/mK >Thickness: 1.5mmT >hardness:75 shore 00 >Colour: Gray >Moldability for complex parts
Applications >Automotive engine control units >Telecommunication hardware >Handheld portable electronics >Semiconductor automated test equipment (ATE) >CPU >display card
Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. Q:Do big buyers have promotional prices? A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices. |
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| Product Tags: Specific Gravity 2.7g/Cc thermal gap pad CPU thermal gap pad 1.5mm silicone thermal pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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