Wholesale Customized Thermal Conductive Gap Filler For GPU CPU Cooling
|
|
Wholesale Customized thermal conductive gap filler for GPU CPU Cooling
Ziitek TIF7120HZ is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.TIF7120HZ is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features
> Good thermal conductive: 7.0 W/mK > Thickness: 3.0mmT > hardness:55±5 > Colour: Blue > Naturally tacky needing no further adhesive coating
Applications
> Cooling components to the chassis of frame
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ:
Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: CPU Cooling Customized gap filler GPU CPU Cooling Conductive gap filler Customized thermal conductive gap filler | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Sticky Soft Heatsink Cooling Gap Filler Thermal Conductive Silicone Pad |
|
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU |
|
Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop |
|
2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material |
|
Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB |
|
Material Specific Thermal Conductivity Thermal Pad For Audio Video Devices |