Specific Gravity 1.9 G/Cc Thermal Pad Silicone For Cpu
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Specific gravity 1.9 g/cc silicone pads Outstanding thermal performance for CPU
The TIF1140-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-01US-Series-Datasheet.pdf
Features > Good thermal conductive: 1.5 W/mK >Thickness: 3.5mmT >hardness:20 shore 00 >Colour: Black >Electrically isolating
Applications >Automotive engine control units >Telecommunication hardware >Handheld portable electronics >Semiconductor automated test equipment (ATE) >CPU >display card
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: How to find a right thermal conductivity for my applications A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. Q: How much are the pads? A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price. |
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| Product Tags: 1.9 g/cc thermally conductive gap filler pads 1.9 g/cc thermal pad silicone thermal pad silicone for cpu | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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