China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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ultra thin mems pcb

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details
11 - 20 of 27

ultra thin mems pcb

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Hard Golden Finger SD Card PCB

Hard Golden Finger SD Card PCB for sale
...memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ... 2024-12-09 19:38:04

0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb

0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb for sale
Thickness 0.1-0.4mm Ultralthin PCB With Minimum 25um Line Width And 50um Line Space Application:writing pad/touch pad,consumer electronics,Smart ... 2024-12-09 19:38:04

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation for sale
Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics... 2024-12-09 19:38:04

ENEPIG plating ic package substrate manufacture

ENEPIG plating ic package substrate manufacture for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Tenting process 25um DRAM IC package Substrate BT material 4 Layer for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

NAND/FLASH Memory Ic packaging Substrate

NAND/FLASH Memory Ic packaging Substrate for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

4layer BT material Sip Packaging Substrate Semiconductor package

4layer BT material Sip Packaging Substrate Semiconductor package for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

line/space 25um FBGA Package Substrate For Memory ic packaging

line/space 25um FBGA Package Substrate For Memory ic packaging for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

finleLine Space IC Package Substrate for Wearable and Automotive Electronics for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11

FBGA/PBGA/LGA Package Semiconductor Substrate manufacture

FBGA/PBGA/LGA Package Semiconductor Substrate manufacture for sale
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -... 2024-12-09 19:45:11
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