81 - 90 of 108
nand memory substrate board
Selling leads
|
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 21:20:17
|
|
... line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, ...
2024-12-09 21:20:17
|
|
...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold ...
2024-12-09 19:38:04
|
|
...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|
|
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ...
2024-12-09 19:38:04
|
|
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
|
|
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
|
|
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
2024-12-09 19:38:04
|
|
...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|
|
...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
|