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nand memory substrate board
Selling leads
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
2024-12-09 21:20:17
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... line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, ...
2024-12-09 21:20:17
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...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold ...
2024-12-09 19:38:04
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...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
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...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ...
2024-12-09 19:38:04
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 20:55:08
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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ...
2024-12-09 21:20:17
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Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
2024-12-09 19:38:04
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...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
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...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
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