multiple wafers nand csp substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

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multiple wafers nand csp substrate

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ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics... 2024-12-09 19:55:37

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

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