improved tenting boc pacakge substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

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improved tenting boc pacakge substrate

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BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate... 2024-12-09 20:39:36

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor ... 2024-12-09 19:55:37

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