China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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ic package substrate with cap plated

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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ic package substrate with cap plated

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Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini... 2024-12-09 19:38:04
Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ... 2024-12-09 19:38:04
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04
...plating ultrathin printed circuit board fabrication with customize/BT FR4/IC substrate Application:Dram memory electronics,Sd card,memory card,all ... 2024-12-09 19:38:04
...,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly... 2024-12-09 19:38:04
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