11 - 18 of 18
horexs camera module pcb
Selling leads
|
...pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally...
2024-12-09 19:38:04
|
|
...pcb production: FR4/BT (0.1-1.0mm) finished thickness; Surface finished:immersion gold/silver/OSP; Copper:1oz/0.5oz or Customize Soldermask:black...
2024-12-09 19:38:04
|
|
...pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally...
2024-12-09 19:38:04
|
|
...pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally...
2024-12-09 19:38:04
|
|
...,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is ...
2024-12-09 19:38:04
|
|
...,the semiconductor packaging substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of ...
2024-12-09 19:38:04
|
|
..., special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC ...
2024-12-09 21:20:17
|
|
... with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat ...
2024-12-09 21:20:17
|