fr4 cob package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

11 - 20 of 137

fr4 cob package substrate

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

...substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor ... 2024-12-09 19:55:37

4 Layer buildup types semiconductor Package Substrate production

...Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate... 2024-12-09 20:39:36

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package... 2024-12-09 19:55:37

0.15mm Thickness 2 Layers IC Package Substrate For memory package

...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; ... 2024-12-09 19:47:52

JEDEC Standard eMCP IC Package Substrate Fabrication

...,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space... 2024-12-09 19:38:04

semiconductor packaging Substrate of DRAM Memory manufacture

...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of ... 2024-12-09 19:55:37

MGC brand BT CSP package Substrate Fabrication

...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil ... 2024-12-09 20:39:36

BGA IC Package Substrate With Cap Plated MGC BT material

...substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics... 2024-12-09 19:38:04

OEM ODM Gold Bonding IC Package Substrate 4 Layer

...substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package... 2024-12-09 19:38:04

AUS308 PSR IC Package substrate manufacture

...substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of ... 2024-12-09 19:38:04

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