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fbga semiconductor substrate
Selling leads
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POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate...
2024-12-09 20:39:36
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... card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package...
2024-12-09 19:38:04
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
2024-12-09 21:46:53
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...substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use ...
2024-12-09 19:38:04
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...Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality ...
2024-12-09 19:38:04
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...,the semiconductor packaging substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of ...
2024-12-09 19:38:04
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...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,...
2024-12-09 19:57:48
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... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
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...Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin ...
2024-12-09 19:45:11
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...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ...
2024-12-09 19:38:04
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